Odisha 3D packaging ground‑breaking
- A groundbreaking ceremony marked a new advanced 3D chip packaging unit in Odisha, India. - The facility focuses on advanced 3D packaging capabilities to support higher‑density chip assemblies. - The project reflects growing regional investment in packaging and heterogeneous integration as wafer scaling becomes harder (youtube.com).
Odisha officials and 3D Glass Solutions broke ground on April 19 for India’s first advanced 3D chip packaging plant at Info Valley near Bhubaneswar. (indianexpress.com) The project is being built by U.S.-based 3D Glass Solutions through its Indian subsidiary, Heterogeneous Integration Packaging Solutions Pvt. Ltd., with an investment of about ₹1,943 crore. Odisha Chief Minister Mohan Charan Majhi and Union Electronics and Information Technology Minister Ashwini Vaishnaw attended the ceremony, and Intel Chief Executive Lip-Bu Tan joined virtually. (indianexpress.com) Chip packaging is the stage after a chip is made, when the silicon is connected, protected and prepared to work inside phones, servers, cars or weapons systems. In 3D packaging, those parts are stacked and linked vertically, like building upward instead of spreading components across one floor. (pmindia.gov.in) The Odisha plant is designed around embedded glass substrates and advanced packaging, a combination the Indian government said can improve efficiency for next-generation semiconductors. The government has said the products from the unit are aimed at uses including missiles, defence equipment, electric vehicles, railway systems, fast chargers, data-center racks, consumer appliances and solar inverters. (pmindia.gov.in) India approved the Odisha project under the India Semiconductor Mission in August 2025 as one of four semiconductor units cleared in that round. The Centre said then that the three projects in Odisha, Punjab and Andhra Pradesh together carried an outlay of ₹4,600 crore. (pib.gov.in) At the groundbreaking, Majhi said the facility is expected to produce 70,000 glass panels a year and 50 million assembled units, while generating about 2,500 direct and indirect jobs. He also said Odisha now has two plants approved under the India Semiconductor Mission. (indianexpress.com) Business Standard reported that the Bhubaneswar unit is one of the semiconductor projects approved by the Centre in August 2025, tying the ceremony to India’s broader effort to build more domestic chip capacity beyond assembly of finished electronics. (business-standard.com) The immediate next step is construction at Info Valley in Khordha district, where Odisha is trying to expand from metals and mining into electronics manufacturing. The opening marked a packaging milestone, but the larger test will be whether the plant reaches the output targets officials announced on April 19. (indianexpress.com)
