AI Arms Race Boosts Taiwanese Chip and Server Suppliers

The global AI infrastructure buildout is creating unprecedented demand for Taiwanese chip and server suppliers from US cloud giants. A supply chain tracker indicates that the demand is fueling a tech "arms race." Advances from foundries like TSMC are seen as directly impacting the performance capabilities of future AI-powered devices.

- Taiwan now commands over 90% of the global AI server assembly market, a significant pivot from consumer electronics manufacturing. For instance, in the second quarter of 2025, AI server and cloud networking revenue at Foxconn surpassed its consumer electronics business for the first time, accounting for 41% of total revenue. - TSMC holds a near-monopoly on the most critical components, manufacturing 99% of the world's custom AI processors and server compute chips. High-performance computing (HPC) workloads, which include AI chips, accounted for nearly 58% of TSMC's revenue in 2025, with advanced 7-nanometer-and-below chips making up 77% of wafer sales. - The global AI server market is projected to expand from approximately USD 30.74 billion in 2024 to over USD 352 billion by 2034, representing a compound annual growth rate of about 27.6%. Key assemblers like Quanta Computer expect AI servers to represent 70% of their server revenue by the end of 2025. - To mitigate geopolitical risks and meet customer demand, major Taiwanese suppliers are expanding manufacturing to North America. Foxconn is scaling operations in Mexico, while Quanta, Wistron, and Pegatron are all increasing production capacity in the United States. - The supply chain extends beyond just chips and assembly to specialized components crucial for AI performance. Companies like Delta Electronics are key suppliers for power and thermal management, while Asia Vital Components provides essential cooling modules and fans for high-power servers. - Advanced packaging technology, such as TSMC's Chip-on-Wafer-on-Substrate (CoWoS), has become a significant bottleneck in the AI chip supply chain. In response, TSMC is doubling its advanced packaging capacity in 2026 to meet the demand from clients like Nvidia. - The trend toward on-device AI, which can be 100 to 1,000 times more energy-efficient per task than cloud-based processing, is expected to drive further demand for specialized, power-efficient chips from Taiwanese foundries. ABI Research projects that on-device AI chipset shipments will reach 1.3 billion units in 2025. - The Taiwanese government is actively fostering this growth through legislation often called its own "CHIPS Act," which provides a 25% tax credit for eligible R&D expenses and a 5% credit for investments in advanced manufacturing equipment.

Get your own daily briefing

Scout delivers personalized news, insights, and conversations tailored to your role and industry.

Download on the App Store

Shared from Scout - Be the smartest in the room.