Tata Semiconductor raises $735M for Dholera fab
Tata Semiconductor secured $735 million in debt financing from foreign banks to build a new fab in Dholera — a material capital step toward expanding local foundry capacity in India. The deal highlights ongoing private investment into alternatives to Taiwan/Korea supply over the medium term. (x.com)
The loan facility for the Dholera unit was signed on February 5, 2026, and the lenders set the facility maturity in 2031. (bwcfoworld.com) The five foreign banks named in filings were HSBC, DBS, MUFG, ANZ and First Abu Dhabi Bank, with individual commitments reported at roughly Rs 1,743 crore (HSBC), Rs 1,697 crore (DBS), Rs 1,147 crore (MUFG), Rs 1,146 crore (ANZ) and Rs 1,102 crore (First Abu Dhabi Bank). (bwcfoworld.com) Lenders imposed ownership and branding covenants that require the Tata group to retain a controlling stake and keep using the Tata brand for the fab entity. (bwcfoworld.com) Creditors also flagged an equity-maintenance covenant that implied Tata Electronics may need to inject additional capital to meet a roughly 30% equity threshold against current borrowings. (communicationstoday.co.in) The Dholera project remains a very large buildout, officially carrying a project capex figure of about ₹91,000 crore and a target wafer-start capacity of 50,000 WSPM in government filings. (pib.gov.in) The bank financings were structured through the lenders’ GIFT City branches in Gandhinagar, a route that bankers cited as enabling more competitive lending terms. (sfctoday.com) Company filings show Tata Electronics had already put roughly ₹690 crore into the semiconductor manufacturing unit since its incorporation in November 2023. (communicationstoday.co.in)
