SEMICON China Spotlights Packaging
SEMICON China opened this week with the industry focused on AI chips and advanced packaging — signaling that integration techniques (co‑packaging, interposers) are now as critical as node scaling. That trend pushes Apple’s systems teams to keep packaging roadmaps and supplier engagements front and center. (digitimes.com)
SEMICON China ran March 25–27, 2026 at the Shanghai New International Expo Centre (SNIEC). (expo.semi.org) The conference’s central Heterogeneous Integration summit was titled “Powering AI Innovations with Heterogeneous Integration Technology,” making HI the headline track across technical sessions. (semiconchina.org) OSAT Amkor confirmed a presence on the exhibition floor to showcase advanced packaging and chiplet solutions during the March 25–27 run of the show. (amkor.com) Industry reporting and Amkor commentary indicate the company plans sizeable 2026 capital spending—roughly US$2.5–3.0 billion—to expand 2.5D and HDFO/advanced packaging capacity. (digitimes.com) Automated-test vendor Teradyne announced it would demonstrate four test platforms aimed at AI, DRAM and high‑volume production and serve as a sponsor of the SEMICON China Design Innovation Forum (booth and sponsorship details in its March 23, 2026 release). (investors.teradyne.com) Organizers and trade coverage at the show cited forecasts that China’s share of global wafer capacity could approach about 42% by 2028 as AI-driven demand and advanced packaging investments accelerate. (scmp.com) Apple’s previously announced expanded partnership with Amkor includes plans for a large outsourced advanced‑packaging facility in Arizona, a concrete example of supplier engagement tied to packaging priorities. (apple.com) Analysts and trade reports have linked Apple’s next‑generation M‑series packaging moves to 2.5D/interposer and wafer‑level multi‑chip approaches, underscoring why systems teams are aligning roadmaps with OSAT and foundry packaging choices. (siliconangle.com)
