AMD CEO headed to Korea for Samsung talks
Social posts say AMD CEO Lisa Su is visiting Korea on March 18 for major chip and memory-related orders tied to Samsung’s upcoming 2nm (SF2/SF2P/SF2X) nodes, which could challenge TSMC’s leadership if it materializes reported reported. The visit is being framed in market chatter as a potential big win for Samsung foundry demand.
Korean outlets report Su will visit Samsung’s Pyeongtaek production complex and hold talks with co-CEO Jun Young-hyun and foundry head Han Jin-man. (en.yna.co.kr) Samsung says it began mass production of sixth‑generation HBM4 in February 2026 and announced commercial shipments, explicitly naming integration with NVIDIA’s Vera Rubin platform. (news.samsungsemiconductor.com) Market research firm TrendForce published that Samsung and SK hynix moved HBM4 validation toward 2Q‑2026 and that Samsung planned a roughly 50% HBM capacity increase in 2026, targeting about 250,000 wafers per month by year‑end. (trendforce.com) Samsung’s 2nm family is split into mobile SF2, performance SF2P and an AI/HPC variant SF2X slated for 2026, according to published foundry roadmaps and industry writeups. (sammobile.com) Industry reports say Samsung’s SF2P yields have climbed into the ~70% range in recent test production runs, a metric analysts flagged as material for attracting outside HPC and datacenter customers. (financialcontent.com) Trade reporting has also circulated wafer‑pricing rumors that Samsung’s 2nm SF2 pricing is significantly lower than TSMC’s N2 estimates — figures cited around $20,000 per wafer for Samsung versus ~$30,000 for TSMC in those pieces. (ic-pcb.com)
