CoWoS/HBM capacity squeezed
Epoch AI noted CoWoS packaging and HBM capacity is nearly fully consumed by AI demand, even as logic fabs still serve broader markets — and that dedicated AI logic chips made up only ~12% of 2025 supply, highlighting allocation pressure for high-bandwidth components tweeted.
Epoch’s [analysis estimated]epoch.ai that NVIDIA, Google, AMD and Amazon together consumed roughly 90% of CoWoS packaging and HBM supply value in 2025. TrendForce and Economic Daily [News reported]trendforce.com TSMC’s CoWoS‑L and CoWoS‑S lines were effectively fully booked into 2026, and Tom’s [Hardware noted]tomshardware.com customers began eyeing Intel’s EMIB/Foveros and domestic OSATs to bypass CoWoS lead times. Market coverage tracked sharp memory cost moves, with analysis outlets reporting HBM‑driven price rises of roughly 60% by [2025 reported]ainvest.com and Q3‑2025 earnings quotes from SK Hynix’s CFO and Micron’s CEO saying HBM calendars for 2025–26 were sold out or fully [booked documented]fusionww.com. Capacity forecasts show CoWoS demand jumping from about 370,000 wafers in 2024 to ~670,000 in 2025 and roughly 1,000,000 in [2026 projected]eu.36kr.com, while advanced‑node lead times for 3nm accelerators stretched past ~50 weeks as orders locked up wafer and packaging [slots reported]siliconanalysts.com.
