TSMC Eyes Arizona Packaging Hub

- TSMC announced plans for a chip packaging facility in Arizona targeted for completion by 2029, while showcasing new semiconductor processes for AI and HPC chips. - The firm also reported a 58% increase in first‑quarter profit and saw shares hit record highs as Taiwan eased single‑stock investment caps. - The shift highlights that advanced packaging (not just fab capacity) is becoming a strategic supply‑chain layer to localise for resilience. (gurufocus.com) (cnbc.com)