TSMC CoWoS booked through 2027

- Social discussions report TSMC's CoWoS advanced packaging capacity is fully booked through 2027, with demand expected to triple by 2028. - The thread highlights constrained CoWoS lanes as a bottleneck for Apple Silicon, NVIDIA GPUs and other advanced HBM‑packed accelerators. - That packaging squeeze reinforces the need to track substrate, assembly and test lead times when planning Apple product ramp and domestic package assembly. (x.com/realarmaansidhu/status/2050250049154646452)