CoWoS supplier drags ex‑GM to court
- Grand Process Technology, a Taiwanese supplier of CoWoS packaging equipment to Taiwan Semiconductor Manufacturing Co., said on April 23 it had sued former general manager Huang Fu-Yuan while denying any key technology reached China. - The company said the case is already in the judicial investigation stage, but added it had “not found” any transfer of key confidential technologies, including equipment or machinery, to China. - The dispute lands as CoWoS capacity remains tight across AI chips and packaging equipment orders are being reshuffled around TSMC suppliers. (digitimes.com)
Grand Process Technology said on April 23 that it had sued former general manager Huang Fu-Yuan and had not found any key technology transfer to China. (technews.tw) (wccftech.com) Grand Process Technology, known in Taiwan as GPTC or Hongsu, makes process equipment used in advanced chip packaging and is identified in local and industry reports as a supplier for Taiwan Semiconductor Manufacturing Co.’s CoWoS lines. (wccftech.com) (digitimes.com) CoWoS, short for chip-on-wafer-on-substrate, is the packaging step that links a processor to high-bandwidth memory after the chip is manufactured. TSMC’s CoWoS capacity has been under strain as Nvidia and other AI chip customers compete for output. (digitimes.com) In its clarification, Grand Process Technology said it had already filed a complaint over suspected trade-secret infringement by the person named in media reports. The company said the matter is now in the judicial investigation stage and that it could not disclose more because the probe is not public. (technews.tw) (wccftech.com) The company also said it “has not found” any flow of key confidential technologies, including equipment and machinery, to China. It called the media reports “untrue speculation” and said the coverage had damaged its reputation. (technews.tw) That response followed local reports alleging that equipment know-how tied to advanced packaging may have moved across the Taiwan Strait through a former executive. Grand Process Technology answered those reports through a material-information filing on April 23. (technews.tw) (finance.biggo.com) The timing overlaps with a broader squeeze in advanced packaging. DigiTimes reported this month that CoWoS capacity remains a bottleneck for AI chips and that equipment orders around a Taiwanese supplier were already being reshuffled amid legal turmoil. (digitimes.com) Grand Process Technology’s statement did not accuse China of receiving its technology, and it did not describe what trade secrets prosecutors are examining. For now, the company’s public position is narrower: it sued a former executive, and it says no key equipment technology has been found to have reached China. (technews.tw) (wccftech.com)