TSMC supplier drags ex‑GM to court

- A key CoWoS-related supplier inside TSMC’s advanced packaging ecosystem has sued a former general manager, while publicly insisting no packaging technology ended up in China. - The action specifically names the ex‑general manager and comes with the supplier’s denial that any technology transfer occurred. - The episode underscores rising trust and talent‑movement concerns inside packaging supply chains as CoWoS and advanced integration grow strategic. (wccftech.com)