AMD publishes enterprise roadmap
AMD is continuing to push enterprise CPU and GPU roadmaps (Venice/Verano, Zen 6, Helios and CDNA updates), reinforcing its bid for larger chip buys and startup partnerships. That roadmap keeps AMD competitive in procurement discussions where price and roadmap matter. (tomshardware.com)
AMD says its next-generation EPYC codename “Venice” was taped out on TSMC’s 2nm (N2) process and is on track for a 2026 launch. (ir.amd.com) Published roadmap details and industry reporting list “Venice” configurations up to 256 cores, reportedly built from eight 32‑core Zen 6c CCDs with roughly 128 MB L3 per CCD for ~1 GB total L3 cache. (tomshardware.com) AMD’s investor materials highlight the Instinct MI350 Series as the fastest‑ramping product and note deployments at cloud providers including Oracle Cloud Infrastructure. (ir.amd.com) The company schedules its Helios rack‑scale designs (MI450 Series-based Helios) to begin shipping in Q3 2026 and states the MI500 family is planned for 2027 in its Financial Analyst Day roadmap. (ir.amd.com) Helios was demonstrated as an open rack‑scale blueprint at OCP Global Summit and AMD describes it as combining EPYC CPUs, Instinct GPUs and Pensando networking aligned to the Open Rack Wide (ORW) standard contributed by Meta. (ir.amd.com) Hardware coverage that analyzed AMD’s Helios and MI400 family published a Helios configuration with 72 MI455X‑class accelerators per rack and detailed projected HBM and bandwidth figures for the MI400 series. (tomshardware.com) AMD’s Advancing AI event materials listed partners including Meta, OpenAI, xAI, Oracle, Microsoft, Cohere, HUMAIN, Red Hat, Astera Labs and Marvell as collaborators and validators of the company’s open AI ecosystem and roadmap. (ir.amd.com)
