TSMC bets on US packaging, delays high‑NA
- TSMC plans to open a chip‑packaging plant in Arizona by 2029. (reuters.com) - The move focuses on advanced packaging — the constrained step that turns wafers into deployable AI modules. (digitimes.com) - TSMC also said it will delay adopting ASML's expensive high‑NA EUV tools through at least 2029, signalling cost‑first roadmaps. (reuters.com)
TSMC said it will open an advanced chip‑packaging plant in Arizona by 2029 and will delay adopting ASML’s high‑NA EUV tools through at least 2029. (reuters.com). (finance.yahoo.com) The company’s schedule was disclosed at a technology event on April 22, 2026, and executives speaking to reporters said the Arizona facility is targeted to come online by 2029. (reuters.com). (msn.com) TSMC framed the Arizona build as focused on “advanced packaging” — techniques such as CoWoS and 3D integration that stitch multiple dies into single AI modules — and said packaging capacity is a current bottleneck for customers like Nvidia. (digitimes.com). (digitimes.com) Deputy co‑COO Kevin Zhang told reporters TSMC has “no current plans” to buy ASML’s newest high‑numerical‑aperture (high‑NA) EUV machines and called the tools “very, very expensive,” adding the firm will rely on current EUV through 2029. (bloomberg.com). (bloomberg.com) TSMC also said its next generation A13 process node is scheduled to enter production in 2029, aligning wafer roadmap, packaging buildout and 3D integration on the same timeline. (electronicsweekly.com). (electronicsweekly.com) ASML, which charges hundreds of millions per high‑NA machine (reports put prices near €350 million), had expected high‑NA to move into volume in 2027–28; TSMC’s pause is being watched as a potential commercial setback. (bloomberg.com). (bloomberg.com) Financial markets reacted: reports said ASML shares fell after the announcement, with intraday moves reported around 1–3% on April 22, 2026. (yahoo.com). (finance.yahoo.com) TSMC’s push to add U.S. packaging capacity follows earlier permit filings and builds on its Arizona wafer fabs; the packaging plant would locally perform the “back end” steps that turn wafers into deployable AI modules. (reuters.com). (finance.yahoo.com) TSMC framed the choices as cost‑driven: the company said it can “harvest the benefit from current EUV” for its near‑term nodes rather than invest immediately in high‑NA capital. (electronicsweekly.com). (electronicsweekly.com) TSMC’s timeline sets a clear near‑term roadmap: an Arizona advanced‑packaging plant and A13 production both targeted for 2029, with the company to reassess high‑NA adoption after that point. (reuters.com). (msn.com)
