Jensen: $1T in Blackwell/Vera demand
At GTC, Jensen Huang said NVIDIA is seeing massive demand for the Blackwell and Vera families — he pegged orders on track toward $1 trillion through 2027. The remark underscores acute capacity pressure across next‑gen GPUs. (cnbc.com)
Last year NVIDIA said it had about $500 billion of high‑confidence demand and purchase orders for Blackwell and Rubin through 2026. (tomshardware.com) (tomshardware.com) NVIDIA’s Vera Rubin NVL72 is a rack‑scale system that the company lists as combining 72 Rubin GPUs, 36 Vera CPUs, ConnectX‑9 SuperNICs and BlueField‑4 DPUs in a reference architecture. (nvidia.com) (nvidia.com) NVIDIA has moved multiple Blackwell SKUs into volume production — including Blackwell B200 and GB200 families — while Rubin family parts are positioned for rollouts in late‑2026 into 2027. (techinsights.com) (techinsights.com; financialcontent.com) Multiple industry trackers report that TSMC’s CoWoS advanced‑packaging lines are effectively fully booked, prompting foundry and OSAT capacity expansions to support multi‑chiplet GPUs. (trendforce.com) (trendforce.com; financialcontent.com) NVIDIA has publicly shifted more Blackwell integration toward TSMC’s CoWoS‑L packaging variant as part of its production ramp, a change industry press links to higher throughput needs for large HBM3e stacks. (tomshardware.com) (tomshardware.com; techinsights.com) GTC announcements included a slate of new Rubin‑era products and partner integrations that industry newsletters catalogued as seven new chips and multiple cloud and systems partnerships shown onstage. (thegpu.ai) (thegpu.ai; nvidia.com)
