NVIDIA shows LogiMAT integrations
NVIDIA highlighted partners at LogiMAT using its tech to stitch together warehousing, sorting and last‑mile delivery — a pitch for GPU‑powered edge and AI in end‑to‑end supply chains. The demos reinforce how compute and AI are moving from analytics pilots into operational workflows. (x.com)
KION Group unveiled a “physical AI” demonstrator at LogiMAT 2025 — a joint solution with NVIDIA and Accenture that used NVIDIA Omniverse to simulate and run AI‑powered industrial trucks and to test warehouse layouts in real time (KION press release, March 11, 2025: ). Linde Material Handling showcased AI for real‑time control of industrial trucks at LogiMAT 2025, linking Omniverse digital twins with live vehicle control to demonstrate on‑the‑fly process optimization and material‑flow decisions (Linde press note, March 10, 2025: coverage: ). EPG announced the world premiere of EPG AURA™ — an AI‑driven supply chain execution environment developed “in close collaboration with NVIDIA” — slated to appear at LogiMAT 2026 (Hall 4, Booth 4A71) as a platform for generative and agentic logistics decisioning (EPG newsroom release: ). Advantech exhibited TREK‑60N hardware integrating NVIDIA Jetson Orin NX modules for on‑device inference, positioning edge Box‑PCs as a deployment path for machine‑vision sorting and automated handling use cases shown at LogiMAT events (LOGISTRA report on Jetson‑based Box‑PC: ). Systems integrators including Dematic staged live demonstrations at LogiMAT 2025 that combined robotics, AI‑driven warehouse‑management integrations and partner ecosystems to present software‑plus‑hardware go‑to‑market models rather than single‑vendor pilots (Dematic press release: industry recap: ). LogiMAT’s scale — more than 1,600 exhibitors from over 40 countries for the March 24–26, 2026 edition — provides commercial reach for NVIDIA‑based Omniverse, Jetson edge modules and partner stacks to move from lab pilots into operational intralogistics and last‑mile demonstrations (LogiMAT official site: Packaging Journal coverage: ).
