Japanese Chipmaker Rapidus Secures Major Funding
Rapidus Corporation, a Japanese semiconductor firm, has secured 267.6 billion yen in a funding round supported by the Japanese government and private companies. The strategic funding is intended to help the company move from its current R&D phase to the mass production of 2-nanometer logic semiconductors by 2027.
Established in August 2022, Rapidus Corporation is a government-backed initiative to reclaim Japan's former dominance in the semiconductor industry. The company is led by Chairman Tetsuro Higashi, former president of Tokyo Electron, and President and CEO Dr. Atsuyoshi Koike, who previously headed Western Digital Japan. The recent funding round saw participation from 32 private companies, including tech and automotive giants like Canon, Fujitsu, NTT, SoftBank, Sony Group, and Toyota Motor Corporation. This private investment of 167.6 billion yen complements the 100 billion yen from Japan's Information-Technology Promotion Agency (IPA). This public-private partnership is a cornerstone of Japan's national strategy to ensure economic and technological resilience by reducing its reliance on foreign semiconductor foundries. Japan's global market share in the semiconductor industry, which was over 50% in the 1980s, has significantly declined, a trend the government is keen to reverse. To achieve its ambitious goals, Rapidus has formed strategic international partnerships. A key collaboration is with IBM for its 2-nanometer gate-all-around (GAA) nanosheet transistor technology. Additionally, Rapidus has joined imec's Core Partner Program, a leading European research hub for nanoelectronics and digital technologies. The company is constructing its advanced manufacturing facility, named IIM-1, in Chitose, Hokkaido. A pilot production line is scheduled to begin operations in 2025, with the aim of starting mass production of 2-nanometer chips by 2027. The 2-nanometer chips that Rapidus plans to produce are critical for next-generation technologies, including artificial intelligence, high-performance computing, and advanced data centers. The company has already started discussions with over 60 potential customers in fields like AI, robotics, and edge computing.
