New SiC power modules hit market

Microchip’s announcement dated March 19, 2026 says the new BZPACK modules were tested to meet HV‑H3TRB criteria that exceed the 1,000‑hour benchmark and feature a CTI‑600V case with substrate options of aluminum oxide (Al2O3) or aluminum nitride (AlN). (microchip.com) The BZPACK family is offered in multiple topologies — half‑bridge, full‑bridge, three‑phase and PIM/CIB configurations — and Microchip highlights a compact, baseplate‑less design with press‑fit solderless terminals and optional pre‑applied thermal interface material to streamline assembly. (ir.microchip.com) Microchip says the modules support common gate‑source voltages (VGS ≥ 15 V), are pin‑compatible with industry standard footprints, and leverage its MB and MC mSiC MOSFET families with AEC‑Q101 qualified options and TO‑247‑4 Notch and die form availability. (microchip.com) Apex’s new MSA303, announced March 19, 2026 and listed on its product pages, integrates three fully independent half‑bridges with a 40 A continuous current capability and a compact 30.5 mm × 41.9 mm body intended for BLDC/PMSM motor drives and DC/AC converters. (apexanalog.com) The MSA303 combines integrated gate drivers, under‑voltage lockout (UVLO), active Miller clamping and silicon carbide Schottky barrier free‑wheeling diodes (no external output diodes required), and Apex says the module is in volume production with an EK94 evaluation kit and samples available. (apexanalog.com) Apex’s release emphasizes reduced parasitics from gate‑driver integration to improve switching performance, while Microchip positions BZPACK for multi‑sourcing and manufacturing consistency via industry‑standard footprints and pin compatibility. (apexanalog.com) (ir.microchip.com)