DRAM squeeze warning
SK Hynix warned that AI data‑center demand could tighten DRAM supplies through 2030, potentially increasing DDR5 and DDR4 prices and pressuring consumer‑electronics inventory (x.com). That’s a signal hardware planners should factor into 2026–27 capex and procurement timelines (x.com).
The warning was voiced by SK Group chairman Chey Tae‑won on March 16 at NVIDIA’s GTC in San Jose, where he said industry capacity takes "at least four to five years" to expand and that SK expects "more than a 20% shortage" in wafer supply. (money.usnews.com) Chey also cited company market positions reported by Counterpoint: SK Hynix holds roughly a 57% share of the HBM market and about a 32% share of global DRAM, underlining why its capacity constraints ripple through AI infrastructure supply chains. (money.usnews.com) SK Hynix has already pre‑allocated much of its near‑term production — multiple industry reports say the company’s advanced DRAM, HBM and NAND output is fully booked through 2026, with large volumes committed to major GPU vendors. (techspot.com) Independent analysts note manufacturers are prioritizing high‑margin HBM and advanced AI memory, which is expected to lift HBM ASPs and divert wafer capacity away from legacy DDR lines, increasing pressure on DDR4/DDR5 availability and pricing. (spglobal.com) Chey told reporters SK Hynix is reviewing a possible U.S. ADR listing and that the company’s CEO may announce measures to stabilise DRAM prices, while adding that overseas fab expansion is constrained by access to power, water and skilled engineers. (whtc.com) South Korean press and industry sources say SK Hynix and Samsung will scale HBM capacity in 2026 — Samsung planning roughly a 50% expansion and SK Hynix increasing its capital investment multiple‑fold to add wafer capacity, commitments that still leave a multi‑year lead time before relieving shortages. (datacenterdynamics.com)
