Intel and AMD Next-Gen CPUs Delayed to 2027
Intel’s 'Nova Lake' and AMD’s 'Zen 6' next-generation CPUs have both been reportedly delayed until 2027. The schedule slips for both chipmakers are attributed to ongoing "industry turmoil," including supply chain and manufacturing process challenges.
- The original launch target for both architectures was late 2026. The delay pushes their consumer desktop releases from an expected late 2026 timeframe to at least the first quarter of 2027, with a potential full unveiling at CES 2027. - Intel's Nova Lake architecture is slated to be manufactured on the company's 18A process node, which is equivalent to a 1.8nm process. This node is the first to combine two major new technologies for Intel: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery. - AMD's Zen 6 architecture is expected to be built on TSMC's 2nm (N2) process, which also marks the foundry's first use of GAA nanosheet transistor technology. Key customers expected to use TSMC's N2 node include Apple, NVIDIA, and AMD. - For Nova Lake, Intel is planning a significant core count increase, with flagship desktop models rumored to feature up to 52 cores, configured as 16 Performance-cores, 32 Efficient-cores, and 4 new Low-Power E-cores. The architecture will introduce new "Coyote Cove" P-cores and "Arctic Wolf" E-cores. - AMD's Zen 6, codenamed "Morpheus," is also set for a core count increase, with its Core Complex Die (CCD) design expected to expand from 8 to 12 cores. This would allow for consumer desktop CPUs with up to 24 cores in a dual-CCD configuration. - Predecessor roadmaps position Intel's Nova Lake after its "Arrow Lake" (Core Ultra Series 2) and "Panther Lake" (Core Ultra Series 3) architectures. AMD's Zen 6 will succeed the Zen 5 "Nirvana" architecture, which powers the Ryzen 9000 series. - One reason cited for the Zen 6 delay is limited manufacturing capacity at TSMC for its new 2nm node and potentially high costs for supporting components like DDR5 memory for the DIY market. - To compete with AMD's successful 3D V-Cache technology, Intel's Nova Lake is rumored to introduce a feature called Big Last Level Cache (BLLC), with some high-end SKUs potentially featuring up to 288 MB of this additional cache.
