TSMC favors cost discipline

- TSMC says it can continue shrinking chips without immediately adopting ASML's priciest high‑NA EUV machines. - The foundry plans to delay high‑NA EUV deployment through 2029 while debuting its A13 technology. - TSMC also intends to open a chip‑packaging plant in Arizona by 2029, signalling a focus on economically efficient scaling and packaging capacity (finance.yahoo.com).