Penang deepens LatAm chip ties
Penang is strengthening supply‑chain links with Latin America as global semiconductor chains shift, potentially opening routes for technology transfer and automation insights that CPG manufacturers could adopt. While the report focuses on chips, the broader supply‑chain playbook—nearshoring, digitalization—matters for regional manufacturing resilience. (thestar.com.my)
The Latin America–Malaysia Semiconductor and Electronics Industry Opportunities Forum convened industry representatives from the United States, Mexico, Costa Rica, Brazil and Colombia alongside the Malaysia Semiconductor Industry Association and international business groups in Penang. (thestar.com.my) Penang Port Commission chairman Datuk Yeoh Soon Hin articulated a “dual‑hub” supply‑chain model during the forum to pair Penang’s manufacturing base with Latin America’s market and resource strengths. (thestar.com.my) Malaysia currently accounts for about 13% of the global outsourced semiconductor assembly and test (OSAT) market, a share Yeoh cited while naming multinationals expanding operations in Penang such as Jabil, Bosch, Western Digital and Lam Research. (thestar.com.my) Chipbond Technology Corporation opened a RM800 million (about US$200 million) advanced packaging and testing facility in Batu Kawan, Penang, with the announcement dated Feb 9, 2026. (theedgemalaysia.com) Bosch officially opened a Penang backend site for final testing of automotive chips and sensors backed by an investment plan of about EUR 350 million and a 100,000‑square‑metre site that includes roughly 18,000 square metres of clean rooms and R&D space for up to 400 associates. (bosch.com.my) Hanic announced on March 4, 2026, a new IC design and advanced packaging hub in Penang supported by InvestPenang, projecting the creation of over 60 high‑value engineering roles focused on SoC design and 2.5D/3D packaging. (investpenang.gov.my) The Penang state government allocated ten acres of industrial land valued at about US$10 million for the Penang Automation, Test and Equipment (ATE) Campus, announced March 13, 2026, to strengthen local semiconductor equipment capabilities. (digitalnewsasia.com) Federal support includes a RM50 million allocation approved for the Penang Silicon Design @5KM+ initiative (to be disbursed as RM10 million per year over five years), and Malaysia’s MITI-led Trade & Investment Mission to Brazil (May 19–23, 2024) yielded agreements to deepen semiconductor cooperation between Malaysia and Brazil. (mida.gov.my)
