India plans 3D chip‑packaging plant

Bhubaneswar is lining up what local and industry reporting describes as India’s first 3D chip-packaging plant, adding an advanced step to the country’s semiconductor buildout. (apacnewsnetwork.com) The proposed greenfield unit would be set up by Heterogeneous Integration Packaging Solutions, described in the report as the Indian arm of U.S.-based 3D Glass Solutions. The project cost is listed at Rs 1,943.53 crore. (apacnewsnetwork.com) APAC News Network reported on April 20 that the central government would provide Rs 799 crore and the Odisha government Rs 399.5 crore in support. Odisha’s semiconductor policy, first notified in September 2023 and amended in February 2024, set up the incentive framework the state is now using to court such projects. (apacnewsnetwork.com) (odisha.gov.in) Chip packaging is the factory stage that turns a finished silicon die into a usable component by enclosing it, wiring it, and preparing it for testing and assembly into electronics. In 3D packaging, chips are stacked or tightly linked to save space and move data faster than with older side-by-side layouts. (meity.gov.in) (apacnewsnetwork.com) India’s semiconductor program has so far been heavier on assembly, testing, marking and packaging than on wafer fabrication. A Ministry of Electronics and Information Technology document said that, as of January 2025, one application had been approved under the Assembly, Testing, Marking and Packaging scheme. (meity.gov.in) That packaging push has accelerated in 2026. Micron said on February 28, 2026 that it had opened India’s first semiconductor assembly and test facility in Sanand, Gujarat, to convert DRAM and NAND wafers into finished memory and storage products. (investors.micron.com) Odisha has been trying to position itself for a larger share of that chain, not just chip design. The state policy says Odisha wants an end-to-end semiconductor ecosystem spanning design, manufacturing, startup activity, research and skilled manpower. (investodisha.gov.in) (odisha.gov.in) The Bhubaneswar proposal also points to a more specialized niche than basic packaging. APAC News Network said the plant would focus on heterogeneous integration and embedded glass substrate technologies, two approaches used to combine multiple chip functions in a smaller package. (apacnewsnetwork.com) Industry reporting earlier this year said the India Semiconductor Mission was tracking one silicon fab and eight packaging units, with more projects under implementation. If the Bhubaneswar plant moves ahead on the terms now reported, it would add Odisha to that map with a facility aimed at the high-density end of chip packaging rather than commodity back-end work. (apacnewsnetwork.com 1) (apacnewsnetwork.com 2)