Telink unveils new SoC and module

Telink launched the TL322X SoC and the ML3228A module at Embedded World, positioning both for next‑gen connected devices and IoT modules TelinkSemi. The announcement aims to raise baseline connectivity and integration for low‑power embedded products, especially in consumer and industrial edge nodes TelinkSemi.

The TL322X is built on a dual‑core 32‑bit RISC‑V architecture ([eefocus.com)] and the company says the family can run Bluetooth Low Energy, Zigbee, Thread, Matter and 2.4GHz proprietary stacks concurrently ([eefocus.com)]. Telink positioned the TL322X for ultra‑low‑latency use cases such as true 8K wireless gaming by highlighting sub‑millisecond reporting and high wireless rates during demos at CES 2026 ([eetimes.com)]. The ML3228A module packages the TL322X into a higher‑integration, “out‑of‑box” module to shorten development cycles and target IoT endpoint designs, with Telink marketing the part as ready for rapid prototyping and production hand‑offs ([eefocus.com)]. Telink presented the TL322X and related demos across 2026 trade shows — including five live demos at CES (Edge AI noise reduction, low‑power 8K wireless gaming, 1‑to‑4 Bluetooth channel sounding, Auracast audio sync, and always‑listening remotes) — underscoring the chip’s multimedia and positioning feature set ([eetimes.com)]. The company’s channel‑sounding and handover solution, which Telink says will be ported to TL322X for improved ranging delay and stability, explicitly targets digital car keys and spatial‑positioning applications ([doc.telink-semi.cn)]. Embedded World 2026 ran March 10–12 in Nuremberg, where Telink showcased the TL322X/ML3228A pair and fielded customer discussions about integration and automotive‑grade use, according to the company’s exhibitor listing and onsite coverage ([embedded-world.de)]. Telink lists SDKs, development kits and reference designs on its developer portal to support TL322X integration and module evaluation, with tooling and firmware resources available via its official documentation and GitHub/Gitee repos ([doc.telink-semi.cn)].

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