Microchip's RTPF500ZT FPGA
Microchip announced the RTPF500ZT, a radiation‑tolerant FPGA using RT Mil‑plastic packaging and JEDEC‑qualified reliability — a lower‑cost, high‑reliability option that could translate into fault‑tolerant financial hardware use cases. The pitch: space‑grade reliability without the usual mission cost overhead. (x.com)
Microchip’s product announcement was dated July 10, 2025 and the company says the RTPF500ZT achieved MIL‑STD‑883 Class B screening and QML Class Q qualification as part of that release. (microchip.com) Engineering samples of an RT PolarFire SoC FPGA — which Microchip describes as integrating a RISC‑V processor with the PolarFire fabric — are being distributed for advanced payload and avionics development. (microchip.com) Microchip and industry write‑ups specifically call out improved single‑event latch‑up (SEL) radiation performance and greater robustness for in‑flight reprogrammability in the RTPF500ZT versus the earlier RTPF500T variant. (satnews.com) The RTPF500 family datasheet lists system resources used in this line — for example, the RTPF500T shows roughly 481,000 logic elements, 33 Mbit embedded SRAM and 1,480 DSP blocks — metrics that apply to the RTPF500 class of devices Microchip is qualifying. (microchip.com) Microchip’s RT Mil‑plastic “MS” variant documentation warns these plastic MS parts are tested across −55°C to 125°C but are provided for hardware functional verification and do not undergo temperature cycling, X‑ray, PIND, assembly Lot B testing or burn‑in and therefore are not recommended as flight‑qualified hardware. (ww1.microchip.com) Package documentation shows the RTPF500ZT family in a 1,509‑column package outline (FC1509) and DigiKey/parts listings reference CG1509/FC1509 package variants and evaluation board items for RTPF500 devices. (ww1.microchip.com)
